Seven product families, specified the same way.

Series S plates are cut from HPHT single crystals grown by the temperature-gradient method and selected for a large, defect-free working face. Because the crystals grow as cuboctahedra, we can cut plates on the (100), (110), (111) and (113) planes from the same material, with the miscut measured and reported for each plate.

Type IIa material has nitrogen below one part per million and the low birefringence and low background fluorescence that optical and spectroscopic work requires. Type IIb material is doped with boron during growth, at up to 10 ppm, which turns the plate into a p-type semiconductor for electrodes, device research and radiation-hard electronics. Dopant level and resistivity are specified per lot.

Plates from 2.5 × 2.5 mm to 10 × 10 mm at 0.5 mm thickness and (100) orientation are held in stock. Formats up to 15 × 15 mm, other thicknesses, other planes and multi-sector plates are cut to order.

Specification

Material

HPHT single crystal, type IIa or IIb (boron-doped)

Nitrogen, IIa

< 1 ppm

Doping on request

boron, up to 10 ppm (type IIb)

Stock formats

2.5 × 2.5 → 10 × 10 mm · 0.5 mm · (100)

Custom formats

up to 15 × 15 mm

Thickness

0.25 – 1.5 mm · other on request

Orientation

(100) · (110) · (111) · (113)

Surface finish

polished one or both faces, Ra ≤ 5 nm

Birefringence

low, cross-polar image on request

Series A anvils are cut from type IIa HPHT crystals chosen for the absence of inclusions, strain and visible dislocations. Low background fluorescence matters as much as strength: ruby and Raman pressure calibration both depend on it, and a strained anvil distorts the very signal used to read the pressure.

We supply flat and bevelled designs with table diameters from 2.60 mm to 4.65 mm, culet diameters and bevel angles to your drawing, and we match anvils in pairs by geometry and optical quality. The pressure a pair will reach depends on culet geometry, gasket and loading, so it is confirmed for each pair against its passport rather than quoted as a single headline figure.

Specification

Material

HPHT single crystal, type IIa

Designs

flat culet · single or multi-bevel

Table diameter

2.60 – 4.65 mm

Culet and bevel

to drawing

Selection

inclusion-free, low strain, low fluorescence

Pairing

matched pairs on request

Documentation

passport per anvil, pair record

Diamond transmits from about 225 nm through the visible and again from roughly 6 µm into the far infrared, with a thermal conductivity that lets a window shed kilowatts without lensing. Series O covers single-crystal windows up to 10 mm across for the highest optical quality, and polycrystalline CVD windows up to 50 mm in diameter where aperture matters more than scatter.

Windows are supplied flat or wedged at 0.5 – 1° to suppress etalon fringes, free-standing or brazed into a flange with a free aperture of up to 30 mm and helium leak rates below 1 × 10⁻⁹ mbar·l/s. Lenses, prisms and non-circular outlines are cut and polished to drawing.

Specification

Material

SC type IIa (HPHT or CVD) · poly optical grade

Single-crystal format

up to 10 × 10 mm · 15 × 15 on request

Polycrystalline format

up to Ø 50 mm (2 in)

Thickness

0.1 – 1.5 mm

Surface finish

Ra ≤ 5 nm SC · ≤ 10 nm poly

Wedge

0.5 – 1° on request

Mounting

free-standing or brazed, aperture ≤ 30 mm

Leak rate, brazed

< 1 × 10⁻⁹ mbar·l/s He

Series Q plates are Series S material with the extra measurements that NV-centre and device work depend on. Substitutional nitrogen is measured by FTIR and reported per plate, boron is reported where specified, and the orientation is held to (100) or (111) with the miscut on the passport. Surfaces can be polished to Ra ≤ 2 nm for shallow-implant and surface-sensitive work.

Low-nitrogen IIa plates and boron-doped IIb material are both available in this format. Coherence data and NV density on treated material can be arranged for qualification programmes.

Specification

Material

HPHT SC, type IIa or IIb (boron-doped)

Nitrogen

measured per plate by FTIR

Boron

up to 10 ppm, measured where specified

Format

2 × 2 → 10 × 10 mm

Thickness

0.3 – 1.0 mm

Orientation

(100) · (111), miscut on passport

Surface finish

Ra ≤ 5 nm · ≤ 2 nm on request

Coherence data

by arrangement

Series T puts diamond directly under the heat source. Three polycrystalline CVD grades let you buy only the conductivity the design needs: tool grade at 700 – 800 W/m·K for cost-driven parts, thermal grade at 900 – 1 200 W/m·K for most laser-diode and RF mounts, and optical grade at 1 700 – 1 900 W/m·K for the hardest problems. Single-crystal IIa spreaders above 2 000 W/m·K are available up to 10 mm across.

Spreaders are supplied flat and smooth for a low interface resistance, metallised with Ti/Pt/Au, Ti/Ni/Au or Cr/Au, and lithographically patterned where top and bottom faces must be electrically isolated or where a solder pad must stop exactly at an edge.

Specification

Grades

tool 700 – 800 · thermal 900 – 1 200 · optical 1 700 – 1 900 W/m·K

Single crystal

IIa > 2 000 W/m·K, up to 10 mm

Format, poly

1.5 × 1.5 mm → Ø 30 mm, laser cut from Ø 50 mm wafers

Thickness

0.1 – 1.0 mm

Surface finish

Ra ≤ 10 nm poly · ≤ 5 nm SC

Metallisation

Ti/Pt/Au · Ti/Ni/Au · Cr/Au

Patterning

lithographic, isolated faces

Attachment

die bonding, soldering, brazing

Diamond's band gap, low atomic number and radiation hardness make it the sensor that keeps working where silicon does not. Series D starts with a packaged universal detector: a 4 × 4 × 0.5 mm single-crystal electronic-grade plate with a 3.5 × 3.5 mm metallised pad, wire-bonded to a standard PCB with an SMA connector and housed in aluminium. Bare plates with custom electrode layouts are supplied for your own packaging.

For synchrotron and accelerator beamlines we make the three families of diamond beam position monitor: fluorescent screens for visual checks, blade monitors with gold contacts that read the beam position from photoemission currents, and instrumented windows with four or more contacts that image smaller beams while doubling as a vacuum window. Membranes and foils from 30 nm on a silicon frame to free-standing 10 – 20 µm, etched to 5 µm where required, complete the series.

Specification

Detector module

4 × 4 × 0.5 mm SC, 3.5 mm pad, SMA, Al housing

Detector plates

SC up to 10 mm · poly up to 20 mm, custom electrodes

Thickness, plates

50 · 100 · 300 · 500 µm

Beam monitors

screens, blades, instrumented windows ≤ 35 mm

Membranes on Si frame

30 nm → 1 µm · 5 mm aperture typical

Free-standing foils

10 – 20 µm · etched to 5 µm

Surface finish

as grown · Ra ≤ 5 nm

Many diamond parts only become useful once they are joined to something: a window in a UHV flange, a detector sealed in a housing, a thin membrane on a carrier that can be handled. Series E covers vacuum brazing of single-crystal and polycrystalline diamond to stainless steel, Inconel, Kovar, copper-nickel, molybdenum and copper, with joints that are vacuum-tight, thermally conductive and bakeable to 300 °C.

Recent work includes sub-millimetre-wave amplifier windows brazed to molybdenum and copper-nickel holders, 10 µm polycrystalline X-ray windows on Kovar, single-crystal windows brazed to copper rings and laser-welded into Inconel plates with nickel and gold plating, and 30 mm polycrystalline windows on stainless UHV flanges certified below 1 × 10⁻⁹ mbar·l/s. We have also bonded diamond to diamond, molybdenum and tungsten carbide.

Specification

Carrier materials

stainless steel · Inconel · Kovar · CuNi · Mo · Cu

Joining

vacuum brazing · laser welding · bonding

Free aperture

up to 30 mm

Diamond thickness

10 µm → 1 mm

Leak rate

< 1 × 10⁻⁹ mbar·l/s He, certified

Bake-out

200 – 300 °C as assembly

Plating

Ni and Au on request